封装电子元件

以环氧树脂和丙烯酸酯树脂为基础的密封和灌封化合物通常用于电子产品中，以保护电子元件、半导体和组件。封装可保护元件免受潮湿、灰尘、污垢和溶剂的侵蚀。密封化合物用于填充空腔或封装元件，还能有效防止机械应力。

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Smart Adhesive Solutions for PCBs brochure

所有 Hoenle 密封或浇注化合物都是无溶剂制造的，许多化合物的离子含量很低，Na+、K+、Cl- 和 Br- 的含量低于 10 ppm。因此，它们能完美地防止内部腐蚀，并降低局部伏特耦合。

许多密封化合物是紫外线固化的，只需几秒钟就能快速固化。这使它们适合在全自动大批量生产中封装元件。另一方面，热固化灌封胶的优点是即使在紫外线照射不到的暗处也能固化。这些灌封胶也有黑色的，可用作涂层或覆盖层。

黑色密封复合物用于保护批量生产的芯片

下表列出了部分 Hoenle 密封剂、密封和浇注化合物。如需更多产品和定制解决方案，请联系我们。

黑色粘合剂用于封装电子元件

要下载技术数据表 (TDS)，请单击粘合剂名称。

Adhesive	Application Areas	Viscosity [mPas]	Base	Curing	Special Properties
Structalit® 5521	-	1,200-2,000 (Rheometer, 25°C, 10s^-1)	epoxy	thermal at 60°C	Non-conductive Outstanding adhesion to high performance plastics (LCP, PBT) High purity Electronic grade standard Flexible
Structalit® 5531	-	5,000-10,000 (Rheometer, 25°C, 10s^-1)	epoxy	thermal at 60°C	Non-conductive Outstanding adhesion to high performance plastics (LCP, PBT) High purity Electronic grade standard Good mechanical stability Good chemical resistance
Structalit® 5800	-	7,000-15,000 mix (LVT, 25°C, Sp. 4/30 rpm)	2-part epoxy	thermal, room temperature	High temperature resistance short pot life fast application
Structalit® 5801	-	12,000-22,000 mix, 10,000-20,000 part A, 18,000-29,000 part B, (Rheometer, 25 °C, 10s^-1)	2-part epoxy	thermal, room temperature	Black color Excellent oil, chemical and moisture resistance Low shrinkage Low water absorption Good adhesion to metal, glass and plastics
Structalit® 5802	-	40,000-65,000 mix (Rheometer, 25°C, 10s^-1)	2-part epoxy	thermal, room temperature	Dark grey color Excellent oil, chemical and moisture resistance Low shrinkage Low water absorption Good adhesion to metal, glass and plastics Flame classification based on UL 94 HB
Structalit® 5810-1	-	3,000-4,000 mix (LVT, 25°C, Sp. 4/30 rpm)	2-part epoxy	thermal room temperature	Very high adhesion to PC resistant to moisture and chemicals
Structalit® 5891	glob top encapsulation plastic bonding SMD assembly	25,000-50,000 ( Rheometer, 25 °C, 10s-1 )	epoxy	thermal	Black color fast curing at low temperatures impact resistant
Structalit® 5891 T	Frame-material for frame&fill	80,000-150,000 (Rheometer, 25 °C, 10s^-1 )	epoxy	thermal	Black color stable frame material, can be applied wet-in-wet with filling material, suitable for frame stacking stable edges resistant to shocks
Structalit® 5893	needle bonding plastic bonding	6,000-10,000 (Rheometer, 25°C, 10s^-1)	epoxy	thermal	Black color excellent flow properties filling material for frame&fill applications high resistance to heat and chemicals certified to ISO 10993-5 standards
Structalit® 5894 M	Glob top encapsulation Encapsulation of electronic components Bonding of electronic components Fill material for frame&fill	20,000-30,000 (Rheometer, 25 °C, 20s ^-1)	epoxy	thermal	Black color excellent flow properties filling material for frame and fill applications on PCBs, very high resistance to heat and chemicals
Structalit® 8801	Attaching components on PCBs, Encapsulation of electronic components,, Encapsulation of plastic parts, Potting material	30,000-45,000 (LVT, 25°C, Sp. 4/6 rpm)	epoxy	thermal	Epoxy-based resin resistant to high temperatures and oil/grease perfect choice for ring applications
Structalit® 8801 black	-	30,000-45,000	epoxy	thermal	Resistant to oils, grease and fuels black color excellent flow properties
Structalit® 8801 T	-	16,000-30,000 (Rheometer, 25 °C, 5s^-1)	epoxy	thermal	Resistant to oils, grease and fuels; Stable; Fast curing at low temperatures
Structalit® 8805	-	30,000-45,000	epoxy	thermal	Resistant to oils, grease and fuels excellent flow properties beige color
Structalit® 8838	Attaching components on PCBs; Encapsulation or potting of electronic components	6,500-7,500 (Rheometer, 25°C, 20s^-1)	epoxy	thermal	Black color flexible potting compound excellent flow properties
Vitralit® 1600 LV	Glob Top Potting Material Encapsulation of electronic components Conformal Coating	3,000-5,000	epoxy	UV secondary heat cure	Very high Tg low water absorption low ion content very high chemical resistance
Vitralit® 1605	optical cement lens bonding cement glass bonding medical device bonding	200-400 (LVT, 25°C, Sp. 2/30 rpm)	epoxy	UV secondary heat cure	low shrinkage low heat expansion very high tg excellent chemical resistance certified to ISO 10993-5 standards
Vitralit® 1650	Fill for frame&fill	3,000-5,000	epoxy	UV	Electronic grade low ion content suitable for chip protection UL94 HB test passed
Vitralit® 1655	Medical devices bonding Flexible potting Optics	150-300 (Brookfield LVT, 25 °C, Sp. 2/30 rpm)	epoxy	UV secondary heat cure	flexible certified to USP Class VI and ISO 10993-5 standards resistant to all common sterilization methods
Vitralit® 1671	Frame material for frame & fill applications	9,000-14,000 (Rheometer, 10s^-1)	epoxy	UV secondary heat cure	Stable frame compound high ion purity electronic grade adhesive high temperature conductivity low water absorption UL94 HB test passed
Vitralit® 1688	glob top encapsulation conformal coating encapsulation of electronic components chip encapsulation potting material smart card	1,200-2,000	epoxy	UV	Excellent flow properties and leveling electronic grade adhesive low ion content suitable for chip protection excellent resistance to heat and humidity
Vitralit® 1691	Fill for frame&fill	20,000-40,000	epoxy	UV secondary heat cure	black color high ion purity electronic grade adhesive high temperature resistance fast surface curing with UV light
Vitralit® 1722	-	5,000-8,000 (LVT, 25 °C, Sp. 4/30 rpm)	epoxy	UV	Very high adhesion to most thermoplastics low shrinkage high temperature resistance
Vitralit® 2004 F	-	60-100 (LVT, 25 °C, Sp. 2/30 rpm)	epoxy	UV secondary heat cure	fluorescing flexible autoclavable dry surface after curing low ion content sprayable
Vitralit® 2007 F	-	150-350 (LVT, 25 °C, Sp. 2/30 rpm)	epoxy	UV secondary heat cure	fluorescing flexible autoclavable excellent chemical resistance low ion content
Vitralit® 2009 F	-	100-200	epoxy	UV secondary heat cure	fluorescing flexible autoclavable high chemical resistance low ion content
Vitralit® 2028	Conformal Coating, Encapsulation of electronic components	160-300	epoxy	UV secondary heat cure	Dry surface after UV-curing autoclavable excellent chemical resistance scratch resistant coating
Vitralit® 4451 MV F	-	2,000-3,000 (LVT, 25 °C, Sp. 4/30 rpm)	acrylate	UV, VIS	soft and elastic dry surface after curing protective coating fast curing fluorescing blue
Vitralit® 5140	Sealing electrical assemblies, breathing masks	250-500	acrylate	UV VIS	Flexible, well suited for bonding plastics with low UV translucence and permeable to visible light, biocompatible: certified to USP Class VI standards
Vitralit® 6103	-	3,500-5,000	acrylate	UV secondary heat cure	Very high adhesion to metals and sintered materials transparent
Vitralit® 6104	Encapsulation of electronic components	3,000-8,000	acrylate	UV secondary heat cure	Very high adhesion to metals and sintered materials
Vitralit® 6104 VT	-	8,000-17,000 (Rheometer, 25°C, 10s^-1)	acrylate	UV secondary heat cure	Very high adhesion to metals and sintered materials ideal for bonding large components on circuit boards (corner bonding)
Vitralit® 6105	-	3,500-6,000	acrylate	UV secondary heat cure	very high adhesion to metals and sintered materials
Vitralit® 6125	-	4,000-6,000 (LVT 25°C, Sp. 4/30 rpm)	acrylate	UV secondary heat cure	excellent adhesion to stone, glass, metals and thermoplastics medium viscosity
Vitralit® 6128	-	800-1,200	acrylate	UV secondary heat cure	very high adhesion to stone, glass, metals and thermoplastics high temperature resistance
Vitralit® 6128 VT	-	3,000-6,000 (Rheometer, 25°C, 10s^-1)	acrylate	UV secondary heat cure	contains chemical activator high temperature resistance high viscosity excellent adhesion to stone, glass, metals and thermoplastics
Vitralit® 9179	-	200-400	acrylate	UV	Fast curing very well suited for automated production lines yellow color dry surface
Vitralit® 9180	-	700-1,200	acrylate	UV	Dry surface fast curing of thick layers yellow color
Vitralit® 9181	-	4,000-7,000	acrylate	UV	Yellow color dry surface fast curing of thick layers
Vitralit® UD 5180	Fixing components, sensor encapsulation in automotive/aerospace industry, bonding lenses, bonding plastic parts and plastic housings	4,000-6,000	epoxy	UV secondary heat cure	Perfect solution for bonding flexible circuit paths resistant to reflow processes grey color
Vitralit® UD 8055	Protective encapsulation of electronic components on PCBs Consumer electronics	5,000-8,000 (Rheometer, 25°C, 10s^-1)	acrylate	UV VIS moisture cure	High Tg Fast curing Compatible with flux Low ion content
Vitralit® UD 8056	Consumer Electronics Protective encapsulation of electronic components on PCBs	3,000-6,000 (Rheometer, 25°C, 10s^-1)	acrylate	UV / VIS / Moisture postcuring	High Tg, fast curing Compatible with flux Low ion content Passed UL94 HB test
Vitralit® VBB-1	Encapsulation of electronic components	1,000-1,500	acrylate	UV VIS	Elastic high peel strength optically clear very flexible suitable for potting