Glob Top 密封化合物

在电子产品中,密封化合物和封装剂通常被用作保护电子元件的所谓 “顶盖”。它们可以保护元件免受潮湿、灰尘、污垢和溶剂的侵蚀。顶盖还能保护敏感元件免受机械应力和刮伤。

Glob Top Adhesive

所有 Hoenle 密封化合物和封装材料都是无溶剂制造的,其中许多材料的离子含量很低,Na+、K+、Cl- 和 Br- 均小于 10 ppm。因此,它们能完美地防止内部腐蚀,并降低局部伏特耦合。

许多密封化合物是紫外线固化的,只需几秒钟就能快速固化。这使它们适合在全自动大批量生产中封装元件。另一方面,热固化密封化合物的优点是即使在紫外线照射不到的阴影区域也能固化。作为覆盖层或涂层使用的黑色颜料球面通常只能进行热固化。

固化后,所有 Hoenle 球帽密封胶均可承受高达 280°C 的短期温度,并且不受回流工艺的影响。Hoenle 的球形顶部粘合剂易于加工,柔韧性高,具有很高的剥离和剪切强度。

黑与亮 粘合剂

新技术是,我们的许多黑色粘合剂现在也可以用紫外线厚层固化。这种新的 Black&Light 技术可以用紫外线完全固化,而无需使用辅助固化机制。该技术与大多数 Hoenle 环氧基 Vitralit® 粘合剂兼容。根据不同的应用,可对粘合剂的黑度和层厚度进行单独调整。

新型 Black&Light 粘合剂的另一大优势在于储存:传统的黑色填充环氧树脂粘合剂通常需要深冻储存,而 Black&Light 环氧树脂则可根据粘合剂的不同在室温或冷藏条件下储存和运输。

You can find more information on these adhesives on our Black&Light page.

下表列出了适用于球顶的部分密封化合物。如需更多产品和定制解决方案,请联系我们。

要下载技术数据表 (TDS),请单击粘合剂名称。

Adhesive Application Areas Viscosity [mPas] Base Curing Special Properties
  • Glob Top
  • Potting Material
  • Encapsulation of electronic components
  • Conformal Coating
3,000-5,000 epoxy UV secondary heat cure
  • Very high Tg
  • low water absorption
  • low ion content
  • very high chemical resistance
  • Fill for frame&fill
3,000-5,000 epoxy UV
  • Electronic grade
  • low ion content
  • suitable for chip protection
  • UL94 HB test passed
  • Frame material for frame & fill applications
9,000-14,000 (Rheometer, 10s^-1) epoxy UV secondary heat cure
  • Stable frame compound
  • high ion purity
  • electronic grade adhesive
  • high temperature conductivity
  • low water absorption
  • UL94 HB test passed
  • glob top encapsulation
  • conformal coating
  • encapsulation of electronic components
  • chip encapsulation
  • potting material
  • attaching components on PCBs
  • SMD assembly
9,000-14,000 (Rheometer, 10s^-1) epoxy UV secondary heat cure
  • Stable frame compound
  • high ion purity
  • electronic grade adhesive
  • high temperature conductivity
  • low water absorption
  • glob top encapsulation
  • conformal coating
  • encapsulation of electronic components
  • chip encapsulation
  • potting material
  • smart card
1,200-2,000 epoxy UV
  • Excellent flow properties and leveling
  • electronic grade adhesive
  • low ion content
  • suitable for chip protection
  • excellent resistance to heat and humidity
  • Fill for frame&fill
20,000-40,000 epoxy UV secondary heat cure
  • black color
  • high ion purity
  • electronic grade adhesive
  • high temperature resistance
  • fast surface curing with UV light
  • medical devices
  • optics
  • electronics
  • lens bonding
  • light shielding
3,500-7,000 (Rheometer, 25 °C, 10s^-1) epoxy UV
  • black colour
  • low shrinkage
  • low CTE
  • high glass transition temperature
  • good chemical resistance
  • resistant to sterilization
  • medical devices
  • optics
  • electronics
  • lens bonding
  • light shielding
3,500-7,000 (Rheometer, 25 °C, 10s^-1) epoxy UV
  • black colour
  • low shrinkage
  • low CTE
  • high glass transition temperature
  • good chemical resistance
  • resistant to sterilization
  • medical devices
  • optics
  • electronics
  • lens bonding
  • light shielding
3,500-7,000 (Rheometer, 25 °C, 10s^-1) epoxy UV/VIS
  • black colour
  • low shrinkage
  • low CTE
  • high glass transition temperature
  • good chemical resistance
  • resistant to sterilization
  • Fixing components,
  • sensor encapsulation in automotive/aerospace industry,
  • bonding lenses,
  • bonding plastic parts and plastic housings
4,000-6,000 epoxy UV secondary heat cure
  • Perfect solution for bonding flexible circuit paths
  • resistant to reflow processes
  • grey color
  • Conformal Coatings
  • Glob Top Encapsulants
8,000-11,000 (Rheometer, 25 °C, 5s-1) acrylate UV VIS secondary moisture cure
  • Isocyanacrylate;
  • fast moisture post-curing in shadowed areas;
  • easy to dispense with jet or dispenser e.a.;
  • resistant to moisture;
  • compatible with flux
  • Protective encapsulation of electronic components on PCBs
  • Consumer electronics
5,000-8,000 (Rheometer, 25°C, 10s^-1) acrylate UV VIS moisture cure
  • High Tg
  • Fast curing
  • Compatible with flux
  • Low ion content
  • Consumer Electronics
  • Protective encapsulation of electronic components on PCBs
3,000-6,000 (Rheometer, 25°C, 10s^-1) acrylate UV / VIS / Moisture postcuring
  • High Tg, fast curing
  • Compatible with flux
  • Low ion content
  • Passed UL94 HB test
  • Consumer Electronics
  • Protective encapsulation of electronic components on PCBs
2,000-4,000 (Rheometer, 25°C, 5s^-1) acrylate UV / VIS
  • Highly transparent
  • Resistant to yellowing
  • High bond strength to several substrates
  • Fill-material for Frame&Fill
3,000-8,000 (Rheometer, 25°C, 10s^-1) epoxy thermal
  • Black color, very good flowability
  • High glass transition temperature
  • No bleeding
  • Very low ionic content (
  • Suitable for semiconductors
  • Fill-material for Frame&Fill
7,000-11,000 (Rheometer, 25°C, 5s^-1) epoxy thermal
  • Very good flowability
  • High glass transition temperature
  • No bleeding
  • Very low ionic content (
  • Suitable for semiconductors
  • glob top encapsulation
  • plastic bonding
  • SMD assembly
25,000-50,000 ( Rheometer, 25 °C, 10s-1 ) epoxy thermal
  • Black color
  • fast curing at low temperatures
  • impact resistant
  • Frame-material for frame&fill
80,000-150,000 (Rheometer, 25 °C, 10s^-1 ) epoxy thermal
  • Black color
  • stable frame material, can be applied wet-in-wet with filling material, suitable for frame stacking
  • stable edges
  • resistant to shocks
  • needle bonding
  • plastic bonding
6,000-10,000 (Rheometer, 25°C, 10s^-1) epoxy thermal
  • Black color
  • excellent flow properties
  • filling material for frame&fill applications
  • high resistance to heat and chemicals
  • certified to ISO 10993-5 standards
  • Glob top encapsulation
  • Encapsulation of electronic components
  • Bonding of electronic components
  • Fill material for frame&fill
20,000-30,000 (Rheometer, 25 °C, 20s ^-1) epoxy thermal
  • Black color
  • excellent flow properties
  • filling material for frame and fill applications on PCBs,
  • very high resistance to heat and chemicals
  • Attaching components on PCBs,
  • Encapsulation of electronic components,,
  • Encapsulation of plastic parts,
  • Potting material
30,000-45,000 (LVT, 25°C, Sp. 4/6 rpm) epoxy thermal
  • Epoxy-based resin
  • resistant to high temperatures and oil/grease
  • perfect choice for ring applications
  • Attaching components on PCBs;
  • Encapsulation or potting of electronic components
6,500-7,500 (Rheometer, 25°C, 20s^-1) epoxy thermal
  • Black color
  • flexible potting compound
  • excellent flow properties

*紫外线 = 320 – 390 纳米 可见光 = 405 纳米

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